美国商务部长吉娜·雷蒙多向路透社表示，台湾半导体制造公司已开始在亚利桑那州为美国客户生产先进的 4 纳米芯片，这是拜登政府在半导体领域努力的一个里程碑。
11 月，美国商务部最终批准向台积电位于亚利桑那州凤凰城的美国子公司提供 66 亿美元的拨款，用于生产半导体。
雷蒙多在接受路透社采访时表示：“这是我们国家历史上第一次在美国本土、美国工人生产尖端的 4 纳米芯片，产量和质量与台湾相当。”她表示，这项计划已于最近几周开始实施。
雷蒙多在谈到此前未披露的生产启动时表示：“这是一件大事，以前从未做过，在我们的历史上也从未做过。很多人都说这不可能。”
台积电是全球最大的代工芯片制造商，也是苹果和英伟达的主要供应商，该公司将于下周公布业绩。该公司发言人周五拒绝置评。
去年4月，台积电同意将计划投资额扩大250亿美元至650亿美元，并在2030年前在亚利桑那州增加第三个生产设施。
Taiwan Semiconductor Manufacturing Co. has begun producing advanced 4-nanometer chips in Arizona for U.S. customers, a milestone in the Biden administration’s semiconductor efforts, Commerce Secretary Gina Raimondo told Reuters.
In November, the Commerce Department finalized a $6.6 billion grant to TSMC’s U.S. unit for semiconductor production in Phoenix, Arizona.
“For the first time ever in our country’s history, we are making leading-edge 4-nanometer chips on American soil, American workers — on par in yield and quality with Taiwan,” Raimondo told Reuters in an interview, saying it had begun in recent weeks.
“That’s a big deal — never been done before, never in our history. And lots of people said it couldn’t happen,” Raimondo said of the previously undisclosed production start.
A spokesperson for TSMC, the world’s largest contract chipmaker and a major supplier to Apple and Nvidia, which reports earnings next week, declined to comment Friday.
In April, TSMC agreed to expand its planned investment by $25 billion to $65 billion and to add a third Arizona production facility by 2030.
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